Global Smt & Packaging Magazine

About Global Smt & Packaging Magazine

18th years of providing the latest technology, process tips and industry news to professionals in the surface mount and advanced packaging industry.

Global Smt & Packaging Magazine Description

Surface-mount technology SMT News – TV – Magazine for Electronics Assembly

Global SMT & Packaging – magazine for electronics manufacturing, enters it’s 17th year providing the latest technology, process tips and industry news to professionals in the surface mount and advanced packaging industry. Global SMT & Packaging is the world’s leading B2B magazine for electronics assembly and advanced packaging professionals with editions in Europe, US, China and Southeast Asia. With three editions (International, China and Southeast Asia) and five websites (International; China; Southeast Asia; Germany, Austria, Switzerland; UK and Ireland). The magazines, websites and newsletters offer solution-led technical articles, business forecasts, insightful columns, coverage of industry news, new products and events.

Global SMT & Packaging is the global reference to learn about the latest technology and process improvements to make your job easier, faster, more reliable and profitable! With magazines, websites, newsletters and video programs, provided by our global team to editors and contributors, we provide the gold standard for technical reporting in the electronics manufacturing industry. Global SMT & Packaging magazine covers all industry sectors involved in electronics assembly such as Aerospace, Telecommunications, Consumer, Industrial, Military, Medical and reports on the latest emerging technologies such as wearables, renewable energy, LEDs and OLEDs. In addition, each issue focuses on the latest manufacturing systems, processes and techniques, including Industry 4. 0, Factory 1. 0 (China) and other IoM (Internet of Manufacturing) technologies.

The International, Southeast Asia, and China editions of the magazine are backed by a heavily visited international website, region-focused websites in key manufacturing locales, including UK /Ireland, Germany, Southeast Asia, and China. We keep our readership up to date on the latest in the industry through our international and region-focused newsletters. Open your mind to a world of possibilities! No other industry publication has the reach and global awareness of Global SMT & packaging. Global SMT & Packaging Magazine, Global SMT & Packaging—China and Global SMT & Packaging—Southeast Asia and their associated websites and newsletters are published by Trafalgar Publications, Ltd.

Global SMT & Packaging continues to be the worldwide electronics manufacturing industry’s most successful brand and respected for its leading edge technology. Our magazine delivers time-sensitive news, in-depth analysis, case studies, real-world applications of new products, industry opinion, and the latest market trends, bringing you the highest quality, most highly educated potential customers worldwide. Indeed the largest growth in 2016 came from Asia, where we have a huge and dedicated following of readers and viewers, eager to learn, using their mobile devices. Recent research confirms that more and more people are accessing the Internet via their mobile devices than ever before. What’s more, most mobile phone users keep them close at hand throughout the day, giving you round-the-clock access to your potential customers.

Our APP (IOS / ANDROID) provide easy access to our monthly or quarterly magazine, daily or weekly newsletters or one of our five websites around the worldwide via our mobile apps. Or perhaps they visited us for one of our Masterclass Webinars which have been a huge success – in 2016. We will continue and expand this Series in 2017. Likewise, our in-depth technical debates at recent trade shows have been extremely well-received and are in line with our goal to be an up-to-the minute educational forum, where we debate the latest technologies and challenges facing electronics manufacturers across the world. All of these activities have been helped by our continued expansion across social media, where we have a larger presence than any other media channel.

Our weekly Facebook Live program is very popular and features interviews and highlights of mergers, acquisitions, new technologies and major events. The program regularly attracts over 4, 000 viewers. In 2017, we will be encouraging you to “Advertise and Socialize”! Modern marketing campaigns are focused on ‘reader or viewer engagement’ and Global SMT & Packaging is pleased to report the highest engagement statistics of any EMS media outlet. And finally, we have extended our expertise to the events arena. In 2016, we held the first Internet of Manufacturing conference (IoM 2016) in San Jose, which was a great success and brought together some of the largest CEMs and suppliers in our industry. In 2017, we are expanding this to a two-day event to include 3D Printing and Robotics, which are set to become a huge part of our fast-changing EMS factory landscape. So take the time to look through the many options we have presented to you in our media kit. If you would like some help to find the most effective campaign for you, our highly experienced team will be more than happy to help you craft a targeted and effective campaign that will meet your needs.

Trevor Galbraith
Editor-in-Chief

The Global Assembly Journal for SMT & Advanced Packaging Professionals

Trafalgar Publications Ltd.
Global SMT & Packaging
Crown House, 72 Hammersmith Rd,
Hammersmith, London, W14 8TH, UK
Tel: + 44 (0) 207 559 1467
Fax: + 44 (0) 207 559 1468
E-mail: news@globalsmt.net
Website: www. globalsmt.net

United States
Trafalgar Publications Ltd.
Global SMT & Packaging
PO Box 7579
Naples, FL 34102, USA
Tel: + 1 (239) 245-9264
Fax: + 1 (239)-245-9268

Asia
M 7 Creations
308-309, 3rd Floor
Vasundhara Enclave
New Delhi 110096 INDIA
Office: + 91 8130068308
Skype: anupreetjaggi

Editor-in-Chief
Trevor Galbraith
Tel: + 1 (239) 245 9264 ext. 101
US Cell: + 1 (239) 287 5401
UK Mobile: + 44 (0)7584 072926
Fax: + 1 (239)-245-9268
Skype: Treva-1
editor@globalsmt.net

D. A. C. H Editor
Stefan Meissner
Tel: + 49 (0)177-2852331
smeissner@globalsmt. de

China Editor
Lu Shuzhen
lshuzhen@trafalgarmedia.com

SUBMIT Ad Materials
www. dropbox.com

Billing
Tel: + 1 (239) 245-9264 x106
accounts@trafalgarmedia.com

IT Support
Leista Burnett
Tel: + 1 (239) 245-9264 x 105
lburnett@globalsmt.net

International Director of Sales
Americas
Sandy Daneau
Tel: (239) 234-1600
skype: sdaneau. 1
sdaneau@globalsmt.net

European Sales and Customer Support
Joanne Galbraith
Tel: + 44 (0) 207 559 1467
Fax: + 44 (0) 207 559 1468
UK Mobile: + 44 (0)141 628 9200
Skype: jgalbraith1965
jgalbraith@globalsmt.net

Southeast Asia
India, Singapore, Korea & Malaysia
Anupreet Singh Jaggi
M 7 Creations
Tel: + 91 8130068308
skype: anupreetjaggi
ajaggi@globalsmt.net

China, Taiwan, Japan & Hong Kong
Paul Chen
Tel: + 86 2154049130
pauljc7777@hotmail.com

Reviews

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This is just a reminder that the “Technology & Networking Event at Comet Lab ONE" will be held Tomorrow - Wednesday, October 4th (3:30PM – 8:00PM) at Comet Group Lab One facility – 3055 Orchard Dr, Suite 150, San Jose, CA 95134. All guests are welcome to bring along their partner or colleagues with them.
Read it Online! https://globalsmt.net/youre-cordially-inv ited-to-a-technol…/
For more information, contact:
... Comet Group - Lab ONE 3055 Orchard Dr, Suite 150, San Jose, CA 95134 Sarvenaz Naderzad • sarvenaz.naderzad@cometusa.com Tel: +1 (408) 325-8770
Global SMT & Packaging Trevor Galbraith • tgalbraith@globalsmt.net Tel: +1 (239) 245 9264 ext. 101
#smt #printedelectronics #ipc #manufacturingautomation #pcbdesign #magazines #electronicsmanufacturing #electronicstechnology #semiconductorpackaging #pcbassembly #smta #electronicspackaging #surfacemountedtechnology #automation #electronics #iot #3dprinting #interviewing #printedcircuitassembly #electronicsystemdesign #printedcircuitboardmanufacturing #globalsmt #electronicsreport #workshops #smtworkshops #techworkshops #cometgroup #siliconevalley #smtinspection #technicalengineering #technicalpapers #technicalwhitepapers #networking #smtnetwork
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www.GlobalSMT.net is a regular source of information about worldwide trends in the PCBA – Printed Circuit Board Assembly, EMS – Electronics Manufacturing Services, ASM – Advanced Semiconductor Materials / Advanced Packaging and SMT – surface mounted technology network. We also give you exclusive access to CEO interviews, webinars, technical workshops, corporate networking, and videos interviews from trade shows /expos / conference / networks.
#smt #printedelectronics #ipc #ma...nufacturingautomation #pcbdesign #magazines #electronicsmanufacturing #electronicstechnology #semiconductorpackaging #pcbassembly #smta #electronicspackaging #surfacemountedtechnology #automation #electronics #iot #3dprinting #interviewing #printedcircuitassembly #electronicsystemdesign #printedcircuitboardmanufacturing #globalsmt #electronicsreport #workshops #smtworkshops #techworkshops #cometgroup #siliconevalley #smtinspection #technicalengineering #technicalpapers #technicalwhitepapers #networking #smtnetwork
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Global SMT & Packaging Magazines READ IT ONLINE: http://smt-pcb-printed-circuit-electronic s-manufacturing-ne…

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http://smt-pcb-printed-circuit-electronic s-manufacturing-ne…
SMT & Packaging Magazine - October 2018 issue Electronics Manufacturing News - Print Circuit Boards Magazine News for SMT & Advanced Semiconductor Packaging Professionals
#smt #printedelectronics #ipc #manufacturingautomation #pcbdesign #magazines #electronicsmanufacturing #electronicstechnology #semiconductorpackaging #pcbassembly #smta #electronicspackaging #surfacemountedtechnology #automation #electronics #iot #...3dprinting #interviewing #printedcircuitassembly #electronicsystemdesign #printedcircuitboardmanufacturing #globalsmt #electronicsreport #3dprint #additivemanufacturing #innovation #PCB #workshops #techworkshops #smtai #smtinspection #spi #aoiinspection #axi #smtmanufacturing #smtelectronics #industry4.0 #x-rayinspection #yxlon #mirtec #technicalpapers #networking #pcbdesign #siliconvalley #siliconvalleynews #technicalengineering
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PVA to host Optical Bonding Seminar in Shanghai -PVA, a global expert in dispensing, coating and custom automation, is pleased to announce that the company is hosting an Optical Bonding Seminar in Shanghai on Thursday, Oct. 11, 2018 at the Marriott Shanghai Hongqiao.
Join PVA for an in-depth educational seminar on optical bonding. Hear from experts in the field, success stories from PVA customers, and view live bonding demonstrations. Respected experts from Heraeus, PVA, Vist...eon, and more will speak on topics such as surface preparation, LOCA selection, dispensing, and of course the optical bonding process.
“We look forward to educating our customers and the local market on the optical bonding process,” says Alex Giordano, PVA’s expert on optical bonding. “Our hope is to have those who attend leave this seminar with a better understanding of all aspects of the bonding process. Our goal is to have all attendees leave this seminar educated and be able to better serve their customers in the display industry.”
The event will conclude with a roundtable Q&A as well as demonstrations. Precision Valve and Automation stands for a meticulous, custom approach to efficient and reliable conformal coating. For more information, please contact PVA at info@pva.net or (518) 371-2684.
www.pva.nethttps://globalsmt.net/trade_sh ow_news/pva-to-host-optical-bonding-semi nar-in-shanghai/
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David Burford brings you some of the week's top stories from around the electronics manufacturing industry including CEG acquires Qualitronics, Jabil’s latest financial results, Next week’s Lab One events plus more! Sponsored by www.MIRTEC.com
#smt #printedelectronics #ipc #manufacturingautomation #pcbdesign #magazines #electronicsmanufacturing #electronicstechnology #semiconductorpackaging #pcbassembly #smta #electronicspackaging #surfacemountedtechnology #automation #electr...onics #iot #3dprinting #interviewing #printedcircuitassembly #electronicsystemdesign #printedcircuitboardmanufacturing #globalsmt #electronicsreport #3dprint #additivemanufacturing #innovation #PCB #workshops #techworkshops #smtai #smtinspection #spi #aoiinspection #axi #smtmanufacturing #smtelectronics #industry4.0 #x-rayinspection #yxlon #mirtec #technicalpapers #networking #pcbdesign #siliconvalley #siliconvalleynews #technicalengineering
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Samsung Reportedly Plans to Cut Memory Production -by Dylan McGrath SAN FRANCISCO — South Korea’s Samsung Electronics is cutting back plans for memory production increases in an effort to keep supplies tight in the face of slowing demand, according to a report by the Bloomberg news service. The report, which cites unnamed sources said to be briefed on the matter, said that Samsung now expects DRAM bit growth of less than 20% this year and NAND flash bit growth of about 30%. S...amsung had said earlier this year that it expected DRAM bit growth of about 20% and NAND bit growth of about 40% this year. Samsung declined to comment in the Bloomberg report and also declined an EE Times request for comment through a spokesperson. After tremendous growth over the past 18 months amid shortages, the memory chip market is softening, with industry analysts warning of a looming downturn amid oversupply.
IC categories forecasted to grow faster than the overall semiconductor market in 2018. (Source: IC Insights)
Market research firm IC Insights said earlier this week that the DRAM market is expected to grow about 53% this year after increasing by 76% in 2017. After rising average selling prices (ASPs) for DRAM continued to boost the market through the first half of the year and into August, the firm said it believes that the DRAM ASP — and subsequent market growth — is at or near its peak, “as a big rise in DRAM capital expenditures for planned capacity upgrades and expansions is likely putting the brakes on steep market growth beginning in 2019.” IC Insights also projects that NAND sales will increase by 29% this year after growing by 46% in 2017. But the NAND market is already headed back to earth with ASPs in decline. DRAMexchange, a research firm that tracks memory chip pricing, projects that NAND ASPs will decline by nearly 10% in the third quarter compared to the second quarter.
https://globalsmtseasia.com/…/samsung-r eportedly-plans-to-…/
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Taiwan Remains Top Hub for Semiconductor Manufacturing -by Matthew Fulco
Global and local firms are making new investments in semiconductor fabs in Taiwan. Taiwan is holding its own as a hub for semiconductor manufacturing, attracting steady new investment from chipmakers and other firms in the industry’s supply chain. The island manufactures about 25-30% of integrated circuits (ICs) globally and is home to Taiwan Semiconductor Manufacturing Co. (TSMC), the world’s largest co...
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SiC Chip Demand Surges -
Electric vehicles drive up market for silicon carbide power semiconductors, but cost remains an issue.
By: Mark LaPedus
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Machine Learning Shifts More Work to FPGAs, SoCs -
SoC bandwidth, integration expand as data centers use more FPGAs for machine learning.
By: Kevin Fogarty
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‘Made in China 2025’: how new technologies could help Beijing achieve its dream of becoming a semiconductor giant -by Elaine Chan
The third instalment of a series on China’s hi-tech industry development master plan looks at semiconductors, and how the country’s rapid embrace of new technologies could help it close the gap with advanced makers A year ago, Chinese government departments across the country received an order from the general office of the Communist Party to hand ...
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Samsung outraces Apple to become top smartphone vendor in Taiwan in August - Max Wang, Taipei; Steve Shen, DIGITIMES
Samsung Electronics overtook Apple to become the top vendor in Taiwan's smartphone market in August with a 19.6% share in terms of sales volume, buoyed by strong sales of its Galaxy Note 9, according to data compiled by local channels. Apple ranked second with a 18.8% share in unit shipments, followed by Asustek at 15.6%, Oppo at 11.5%, HTC at 6.2%, Sony Mobile... Communications at 5.6% and Xiaomi at 5%. However, Apple took the top spot in terms of sales value with a 41% share, followed by Samsung at 19.8%, Oppo at 9.9%, Asustek at 8.8%, Sony Mobile at 6.1%, HTC at 4.3% and Huawei at 3.3%. Apple is expected to see it shares in terms of unit shipments and sales value increase significantly in September following its launch of the iPhone XS and XS Max in the local market in the month, according to market sources. Sales of smartphones through retail channels in Taiwan totaled 540,000 units in August, up 1.9% on month but down 8.47% on year. The top-10 bestselling models in August were: iPhone 8 Plus 64GB, ZenFone Live (L1) ZA550KL, Oppo R15, Galaxy J4, iPhone 6s Plus 32GB, iPhone 8 64GB, Sugar Y12s, HTC Desire 12, Galaxy J2 Pro (2018) and ZenFone 5.
https://globalsmtseasia.com/…/samsung-o utraces-apple-to-be…/
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Chipmakers to gain from robust demand for smart voice-based devices - Cage Chao, Taipei; Willis Ke, DIGITIMES
MediaTek is likely to land handsome orders for smart voice service chipsets from Amazon as the web giant is extending its built-in Alexa smart voice software to a variety of devices including microwaves, speakers, video receivers, and automotive electronics gadgets, and the Taiwan chipmaker is also expected to easily win similar orders from Google, Alibaba and Xiaomi,... according to industry sources. The sources said that shipments of Amazon Echo, Google Home and smart voice-assistant devices from Alibaba and Xiaomi have been picking up significantly since the beginning of 2018, and global shipment of such devices so far have run close to total annual shipments for 2017, though the traditional fourth-quarter peak shipment season has yet to come. Market estimates for sales of smart speakers and other voice-enabled devices have been constantly adjusted upward along with the approaching of shopping festivals associated with China's National Day holidays and November 11 Singles' Day, as well as the year-end holidays in Europe and the US. As smart voice-forward devices are badly needed to connect IoT, cloud service, AI and smart home segments, MediaTek has seen shipments of its chipsets for smart voice-enabled devices rise to a new quarterly high in the third quarter of 2018, significantly driving up its overall revenues for the quarter and adding growth momentum to the firm's revenue performance in the coming quarters. MediaTek's smart voice-based device chip platform can now integrate almost all the solutions including MCU, Wi-Fi, Bluetooth, and power management chips into an SoC. But the proliferation of diverse smart voice-assistant devices and the ever-increasing new functions have spelled good business opportunities of chipmakers dedicated to MCUs, LCD driver ICs, analog ICs, QWi-Fi chips and Bluetooth chips. Such Taiwan MCU makers as Holtek Semiconductor, Nuvoton Technology, Weltrend Semiconductor, and Elan Microelctronics, as well as MEMS microphone supplier ZillTek Techonology, WI-Fi chipmaker Realtek Semiconductor and Bluetooh 5.0 chip solution provider Rafael Micro are all gearing up to cash in on the ever-expanding global shipments of smart speakers and other voice-assistant devices.
https://globalsmtseasia.com/…/chipmaker s-to-gain-from-robu…/
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How will Graphene, the 2D Wonder Material, Change the Semiconductor Industry? -Materials innovation has always been vital to the semiconductor industry. In the past, it was high-κ gate dielectrics. Today, Cobalt is seen as a replacement for Tungsten in middle-of-line (MOL) contacts.
What materials innovation will the future bring?
A likely answer is Graphene, the wonder material discovered in 2004.
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Qualcomm Says Apple Gave Stolen Trade Secrets to Intel -
Dylan McGrath
SAN FRANCISCO — Qualcomm turned up the heat in its high-profile feud with longtime customer Apple, accusing the iPhone maker of feeding proprietary information about Qualcomm chips to rival Intel.... In a court filing made Tuesday, Qualcomm accused Apple of "a multi-year campaign designed to steal Qualcomm's confidential information and trade secrets." The filing alleges that Apple took information provided by Qualcomm software development tools and used to improve the performance and time-to-market of "lower-quality modem chipsets," including those made by Intel. Qualcomm had been the supplier of baseband chips to every generation of iPhones since the first iPhone debuted in 2007. But the relationship between the two companies turned sour in 2016 over a royalty payment dispute. Last year, the two companies traded lawsuits in multiple venues, including a $1 billion suit filed by Apple against Qualcomm and a separate suit brought by Qualcomm against Apple in San Diego last November. Teardowns of the latest iPhones announced earlier this month have confirmed that they use Intel modem chipsets exclusively. In the November suit, Qualcomm alleged that Apple accidentally passed its confidential information to Intel. But Tuesday's filing,which amends the November suit, takes the claim much further, claiming that its analysis of discovery documentation found that Apple has "wrongfully acquired, failed to protect, wrongfully used, wrongfully disclosed and outright stolen" Qualcomm's confidential information and trade secrets and used it to divert its chipset business to Intel. The filing alleges that Apple engineers working to incorporate Intel chipsets into Apple devices repeatedly accessed used, and provided to Intel engineers Qualcomm software and confidential information — including source code — for the purpose of improving the performance of Intel's chipsets “Once again Apple has flouted its contractual commitments and misappropriated Qualcomm’s property rights in an effort to improve its performance and increase its profits," a Qualcomm spokeswoman said in a statement emailed to EE Times. "The code, tools and design details of Qualcomm’s modem technology which are the subjects of this litigation represent the genius and labors of our dedicated engineers. We have only the rule of law to protect them.” Apple did not immediately respond to EE Times' request for comment. The suit is currently scheduled to go to trial next April. — Dylan McGrath is the editor-in-chief of EE Times. https://globalsmtseasia.com/…/qualcomm- says-apple-gave-sto…/
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More about Global Smt & Packaging Magazine

Global Smt & Packaging Magazine is located at 239 Kensington High Street, W14 8TH London, United Kingdom
+442392459264
http://www.globalsmt.net